當(dāng)串焊機(jī)出現(xiàn)焊接不牢固等故障該怎么解決

當(dāng)串焊機(jī)出現(xiàn)焊接不牢固等故障時(shí)，可針對(duì)不同故障類(lèi)型采取以下處理方法：

When welding defects such as weak soldering occur in string welders, the following handling methods can be adopted for different types of faults

一、虛焊問(wèn)題

1. False Soldering Issues

判定與檢測(cè)Judgment and Detection

肉眼觀察：眼睛以30°角度偏差觀察電池串，可發(fā)現(xiàn)虛焊異常。

Visual Inspection: Observe the cell strings at a 30° angle deviation to identify false soldering anomalies.

EL檢測(cè)：通過(guò)電生光原理拍攝照片并拼接成完整圖像，電池片上沿主柵方向?qū)ΨQ(chēng)性發(fā)暗區(qū)域即為虛焊。

EL (Electroluminescence) Detection: Take photos based on the electro-luminescence principle and stitch them into a complete image. The symmetrically dark areas along the main grid direction on the cell indicate false soldering.

原因分析與處理Cause Analysis and Handling

溫度因素：焊接溫度過(guò)低或加熱時(shí)間不足，需增加對(duì)應(yīng)位置燈管功率或延長(zhǎng)焊接時(shí)間。

Temperature Factors: If the soldering temperature is too low or the heating time is insufficient, increase the power of the lamp tube at the corresponding position or extend the soldering time.

助焊劑問(wèn)題：濃度不足時(shí)提升烘干溫度，海綿材料問(wèn)題需更換，被烤干時(shí)檢查補(bǔ)液系統(tǒng)。

Flux Issues: Increase the drying temperature if the concentration is insufficient; replace the sponge material if it is faulty; check the fluid replenishment system if the sponge is dried out.

壓針故障：脫落或卡滯導(dǎo)致接觸不良，需檢查壓針零件狀態(tài)并調(diào)整位置。

Pressing Pin Faults: Loose or stuck pins cause poor contact. Inspect the condition of the pressing pin components and adjust their positions.

焊帶與銀漿問(wèn)題：錫層過(guò)薄需減小拉伸比并檢查通道刮錫，銀漿不匹配需更換電池片。

Tape and Silver Paste Issues: If the tin layer is too thin, reduce the stretching ratio and check the tin scraping in the channel; replace the cell if the silver paste is incompatible.

二、設(shè)備運(yùn)行異常

2. Equipment Operation Abnormalities

傳輸帶跑偏Conveyor Belt Deviation

調(diào)節(jié)糾偏裝置：內(nèi)側(cè)跑偏時(shí)順時(shí)針調(diào)外側(cè)螺釘，外側(cè)跑偏時(shí)順時(shí)針調(diào)內(nèi)側(cè)螺釘，直至傳輸帶無(wú)偏移。

Adjust the Alignment Device: When the belt deviates inward, turn the outer screw clockwise; when it deviates outward, turn the inner screw clockwise until the belt is aligned.

轉(zhuǎn)盤(pán)氣管打結(jié)Turntable Air Pipe Knotting

檢測(cè)與操作：?jiǎn)?dòng)設(shè)備直至消除B、C轉(zhuǎn)盤(pán)氣管打結(jié)現(xiàn)象。

Detection and Operation: Start the equipment and run it until the knotting of the air pipes in turntables B and C is eliminated.

空氣壓力不足Insufficient Air Pressure

檢查氣路系統(tǒng)：確認(rèn)空氣壓縮機(jī)、氣路及氣壓調(diào)節(jié)器工作狀態(tài)。

Check the Pneumatic System: Ensure the air compressor, air circuit, and pressure regulator are in proper working condition.

三、焊帶與材料問(wèn)題

3. Solder Tape and Material Issues

焊帶扭曲露白Twisted Solder Tape with Exposed White Areas

檢測(cè)與調(diào)整：停機(jī)后檢查緩存裝置，調(diào)整扭曲焊帶并確保拉出合格焊帶。

Detection and Adjustment: After stopping the machine, inspect the buffer device, adjust the twisted solder tape, and ensure qualified tape is fed out.

焊帶溢錫Solder Tape TinOverflow

溫度與壓力調(diào)節(jié)：降低預(yù)熱板溫度5-10℃，調(diào)整壓針壓力。

Temperature and Pressure Adjustment: Reduce the preheating plate temperature by 5-10°C and adjust the pressing pin pressure.

焊帶露白控制Control of Exposed White Areas on Solder Tape

清潔與調(diào)整：定期清洗焊帶卡爪（1-2次/小時(shí)），調(diào)整壓針高度及焊帶導(dǎo)向槽位置。

Cleaning and Adjustment: Regularly clean the solder tape claws (1-2 times per hour), and adjust the height of the pressing pins and the position of the solder tape guide groove.

四、其他常見(jiàn)故障

4. Other Common Faults

電池串片間距不均Uneven Spacing Between Cells in Cell Strings

設(shè)備檢查：確認(rèn)進(jìn)氣閥氣壓，清潔焊臺(tái)并去除助焊劑結(jié)晶。

Equipment Inspection: Confirm the air pressure of the intake valve, clean the soldering station, and remove flux crystals.

焊帶起焊點(diǎn)偏移Offset of Solder Tape Starting Point

參數(shù)調(diào)節(jié)：根據(jù)起焊點(diǎn)位置增減焊接功率與時(shí)間，必要時(shí)調(diào)整遮光板位置。

Parameter Adjustment: Increase or decrease the soldering power and time according to the starting point position, and adjust the position of the light shield if necessary.

焊帶拱起Solder Tape Arching

清洗與調(diào)整：清洗沖Z模具及后壓爪，調(diào)整沖Z位置旋鈕。

Cleaning and Adjustment: Clean the Z-punching mold and rear pressing claws, and adjust the Z-punching position knob.

正面焊帶凸起物Protrusions on Front Solder Tape

壓針維護(hù)：清除表面焊錫殘留物，調(diào)整壓針壓力。

Pressing Pin Maintenance: Remove surface solder residues and adjust the pressing pin pressure.